PHOTO-LITHOGRAPHY Available for Booking
  • TECHNICAL SPECIFICATIONS:-

    195mm x 195mm maximum writing area

    230mm x 230mm x 15mm maximum wafer size.

     0.6µm, 1µm, 2µm and 5µm resolutions across full writing area

    Automatic selection of resolution via software – no manual changing of lens required.

     385nm long-life semiconductor LED light source, suitable for broadband, g-, h- and i-line positive and negative photoresists (e.g. S1800, ECI-3000, MiR 701, SU-8). Dual wavelength light source (385nm and 405nm) available as option

     XY interferometer for precise motion control.

     Extremely fast writing speed - up to: 25mm2/minute (0.6µm resolution), 50mm2/minute (1µm resolution), 100mm2/minute (2µm resolution) and 180mm2/minute (5µm resolution). These allow a typical 50mm x 50mm area combining critical and non-critical areas to be exposed in under 30 minutes or a typical 100mm x 100mm area to be exposed at 2µm resolution in under 2 hours.

     Autofocus system using yellow light which automatically tracks surface height variation during exposure, compensating for bowed or inclined substrates and surfaces with highly irregular topography. No minimum wafer size.

     High quality infinite conjugate optical microscope camera with x3 aspheric objective lens and x5, x10 and x20 Olympus plan achromatic objective lens and yellow light illumination for alignment to lithographic markers on the wafer (±0.5µm 3σ alignment accuracy).

     Automatic changing between microscope magnifications via software – no manual changing of lens required. Additional x4 digital zoom can be selected in software.

     Grey scale exposure mode for 3-dimensional patterning (255 grey levels).

     Software API for external interfacing and control.

    100nm minimum addressable grid; 20nm sample stage resolution.

     Acceptable file formats: CIF, BMP, TIFF and (via Clewin 5) GDSII.

     Built-in 2-dimensional optical surface profiler (100nm thickness resolution) for examining exposed resists, deposited layers, etching and other MEMS process steps.

     Automatic wafer inspection tool allowing each die on a wafer to be imaged.

     Virtual mask aligner mode in which the pattern to be exposed is displayed on top of the real-time microscope image, allowing the machine to be used like a traditional mask aligner.

      Includes passive vibration-isolation optical table with integrated   monitor and keyboard mount.

     Light-excluding enclosure with safety interlock

     Temperature stabilisation to ±0.5°C

     Easy to use, Windows® based control software supplied.

     Supplied with Clewin 5 mask design software.

     Supplied with pre-configured 64-bit Windows® 10 PC with monitor,   keyboard and mouse

     Includes on-site installation by trained service technician.

     Extremely competitively priced for University and industrial R&D   budgets.

     90-260 VAC, 50-60Hz, 4A single phase power requirement.

     Footprint 90cm (w) x 75cm (d); height 153cm (including optical table)

     CE-marked and compliant with EN-61010.

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  • Faculty Incharge:

    Name: Dr. Rakesh Kumar

    Asso. Prof

    Ph no: 1881-232479

    Email: rakesh@iitrpr.ac.in

     

    Operator:

    Ms. Shital Chowdhary

    Ph. no.: 01881-23-2568/ 2570

    Email:  bookings.cmnf@iitrpr.ac.in