M. S. Courses

Code Name L-T-P-S-C
EEL611 Advanced Physical Electronics 3 (3-0-0)
Review of quantum mechanics, E-k diagrams, effective mass, electrons and holes in semiconductors, band diagram of silicon, carrier concentration, carrier statistics, career transport, junction devices(P-N junction, Metal –semiconductor junctions, solar cells etc), MOS capacitor as a building block for MOSFETs (Ideal MOS, real/Non ideal MOS, band diagrams, C-V characteristics, electrostatics of a MOSCAP), MOSFET, I-V characteristics, scaling, short channel and narrow channel effects, high field effects, Transport phenomenon in nanoelectronic devices (CNTFETs, Graphene Transistors)
EEL612 Advanced Semiconductor Devices 3 (3-0-0)
MOS Capacitor as a building block for MOSFETs (Ideal MOS, Non-Ideal MOS), CV and IV technique MOSFET IV characteristics, Scaling, Short Channel and Narrow Channel Effects, High Field Effects, Gate oxide thickness scaling trend, SiO2 vs High-k gate dielectrics. Integration issues of high-k, Interface states, bulk charge, band offset, stability, reliability - Qbd, SOI - PDSOI and FDSOI, Vertical 27 transistors - FinFET and Surround gate FET, Thickness measurement techniques: Contact - step height, Optical - reflectance and ellipsometry, AFM, Characterization techniques for nanomaterials: FTIR, XRD, AFM, SEM, TEM, EDAX etc., Optoelectronic devices, MESFETs, HBTs, HEMTs, MODFETs
EEL613 VlSI Fabrication Technology 3 (3-0-0)
Overview of Semiconductor IC Process technologies. Crystal growth (Czochralski, Float Zone, polishing, gettering, challenges) Oxidation (kinetics, Deal-Grove model, rate constants, high pressure oxidation, dopant effects, two and three dimensional effects, defects). Deposition techniques (vacuum evaporation, sputtering, CVD, LPCVD). Epitaxy (including MBE, MOCVD, CBE, UHV-CVD). Diffusion (Fick's model, concentration dependent models, field effect, band-gap narrowing effect, anomalous effects). Ion implantation (Ion stopping, range distributions, damage, annealing, high energy implants). Rapid thermal annealing. Lithography (optical, e-beam and x-ray; resists). Etching (wet chemical, dry reactive ion-etching, anisotropic etches, defect delineation). Interconnect technology.
EEL614 Digital IC Design 3 (3-0-0)
Field-effect transistors: MOS capacitor, NMOS and PMOS transistors, i-v characteristics, channel length modulation, body-effect, MOSFET biasing, capacitance in MOS transistors; MOS based circuit design: NMOS inverter and its classification, NMOS logic gates, power dissipation, dynamic behavior; CMOS logic design: CMOS inverter, static and dynamic behavior, logic gates using CMOS, minimum gate size, static and dynamic latches and registers, optimization of sequential circuits, cell-based design methodology, timing issues; Modeling of high-speed interconnects: Interconnect parameters, electrical models – lumped versus distributed, SPICE based interconnect models; MOS based memory circuits: Design of memory circuits, RAM, basic memory cell, sense amplifiers, address decoders, cascade buffers.
EEL615 Synchrophasor Technology & ITS Applications In Power 3 (3-0-0)
Synchrophasor Technology- basic architecture and communication requirement, Phasor and frequency estimation, wide area monitoring and control in real time : basic principles, Transient stability monitoring and control, power oscillation monitoring and control, wide area power system stabilizers, synchrophasor applications in power system protection and emergency control, hybrid state estimation, Real time monitoring and control voltage stability, fault detection and location using synchronized measurements, Model development and validation using synchronized measurements.
EEL616 HVDC and Flexible AC Transmission Systems 3 (3-0-0)
General aspects of DC transmission, converter circuits and their analysis, DC link controls, faults and abnormal operation and protection; Mechanism of active and reactive power flow control; Basic FACTS controllers: SVC, STATCOM, TCSC, TCPAR, UPFC; Modeling of FACTS Controllers; System static performance improvement with FACTS controllers; System dynamic performance improvement with FACTS controllers.
EEL617 Transients in Power Systems 3 (3-0-0)
Introduction, Switching Transients, Over voltages due to switching transients - resistance switching , load switching, waveforms for transient voltage across the load and the switch, Lightning transients, Theories in the formation of clouds and charge formation, mechanism of lightning discharges and characteristics of lightning strokes, Computation of transients , Traveling wave concept, step response, Bewely’s lattice diagram
EEL618 Advances in HVDC Transmission Technology 3 (3-0-0)
Overview of HVDC Projects World Wide ,Developments in High Voltage, High Power Fully Controlled Semiconductors, HVDC Transmission System Configurations, Back-to-back, Monopolar, Bipolar and Multi-Level HVDC Systems, Concepts of VSC-HVDC, Vector Diagram, Multi-Level VSC Topologies, PWM Technique, Differences between CSC-HVDC and VSC-HVDC systems, HVDC aided by Power Cable Transmission, Space requirements and Right of Way, Advantages of HVDC Cable Transmission over HVDC Overhead Transmission, Latest developments in Power Cable Technology for HVDC Transmission.
EEL619 Nanotechnology and Nano-composites 3 (3-0-0)
Introduction, Introduction to nanoscience and nanotechnology: History, background scope and interdisciplinary nature of nanoscience and nanotechnology, Synthesis and nanofabrication, Bottom-Up and Top-Down approaches. Chemical preparation methods, Phsical Mehtods-Biological methods- Material Characterization Techniques, Nanocomposites, Composite material, Mechanical properties of Nano composite, Modeling of nanocomposites.
EEL620 Power Cables 3 (3-0-0)
Historical Perspective of Electrical Cables, Basic Dielectric Theory of Cable, Conductors, Electrical characteristics of Cables, Shielding of Cables, Sheaths, Jackets, armors, Standards and Specifications, Manufacturing, Installation, Splicing, Terminating and Accessories, Ampacity of Cables, Properties of Soil, Lightning Protection.
EEL621 Power Transformers 3 (3-0-0)
Main aspects of Transformer Condition Monitoring, Thermal Modelling, Dissolved gas analysis, Frequency response analysis, Partial discharge analysis, Drawbacks of conventional techniques, Inaccuracy of empirical thermal models, Uncertainty in DGA, Intricate issues with winding deformities, Modelling of Transformer and Processing Uncertainty.
EEL622 Signal Processing and Applications 3 (3-0-0)
Review of Signals and Systems, Sampling and data reconstruction processes. continuous time Fourier transform (CTFT), DTFT, Z transforms. Discrete linear systems. Frequency domain design of digital filters. Quantization effects in digital filters. Discrete Fourier transform and FFT algorithms. High speed convolution and its application to digital filtering. Applications.
EEL623 Feature Extraction and Pattern Recognition 3 (3-0-0)
Image Preliminaries, Wavelets and Multi-resolution Processing: Multi-resolution Expansions, Wavelet Transforms in 1-D and 2-D, The Fast Wavelet Transform, Wavelet Packets Transform. Feature Extraction: Color, Texture, Shape and structure Features in spatial and frequency domains, Corner Detection, Hough Transform, Principal Component Analysis, Linear Discriminate Analysis, Feature Reduction in Input and Feature Spaces. Pattern Recognition: The Unsupervised Clustering Algorithm, Bayes Classifier, Support Vector Machine, Neural Networks, Fuzzy Sets in Image Analysis.
EEL624 Advanced Digital SignalProcessing 3 (3-0-0)
Multiresolution/ multiscale analysis, Piecewise constant approximation - the Haar wavelet, Building up the concept of dyadic Multiresolution Analysis (MRA), A review of discrete signal processing, Families of wavelets: Orthogonal and biorthogonal wavelets, Daubechies' family of wavelets in detail, Journey from the CWT to the DWT, Discretization in steps, Discretization of scale - generalized filter bank, Discretization of translation - generalized output sampling, Variants of the wavelet transform and its implementational structures, The wavepacket transform, The lattice structure, The lifting scheme, An exploration of applications.
EEL625 Computer Vision 3 (3-0-0)
Digital Image Formation and low-level processing. Depth estimation and Multi-camera views. Feature Extraction: Edges - Canny, LOG, DOG; Line detectors (Hough Transform), Corners - Harris and Hessian Affine, Orientation Histogram, SIFT, SURF, HOG, GLOH, Scale-Space Analysis- Image Pyramids and Gaussian derivative filters, Gabor Filters and DWT. Image Segmentation: Region Growing, Edge Based approaches to segmentation, Graph-Cut, Mean-Shift, MRFs, Texture Segmentation; Object detection. Pattern Analysis: Clustering: K-Means, K-Medoids, Mixture of Gaussians, Classification: Discriminant Function, Supervised, Un-supervised, Semi-supervised; Classifiers: Bayes, KNN, ANN models; Dimensionality Reduction: PCA, LDA, ICA; Non-parametric methods. Motion Analysis, Shape from X, Applications: CBIR, CBVR, Activity Recognition, computational photography, Biometrics.
EEL627 Power System Protection 3 (3-0-0)
Introduction to protection and the basic issues. Revision of fault studies and grounding. Fuses and switchgear. Relaying principals. Voltage and current sensors. Non pilot protection of transmission lines. Pilot protection of transmission lines. Protection of rotating machinery .Protection of transformers, System issues.