Publication of Department of Electrical Engineering annual year 2014-15

Department of Electrical Engineering

Books

1. R. Sharma, “Design of 3D Integrated Circuits and Systems,” CRC Press, 2014.

Book Chapters

1. R. Sharma and K. Choi, “Emerging interconnect technologies for 3d networks-on-chip,” in design of 3d integrated circuits and systems, Rohit Sharma and Krzysztof Iniewski (Eds.), CRC Press, 2014.

Journals

1. R. Sharma et. al., “Airgap interconnects: modeling, optimization and benchmarking for backplane, pcb and interposer applications”, IEEE Transactions on Components, Packaging and Manufacturing Technologies, vol. 4, no, 8, pp. 1335-1346, 2014.

2. G. Dua, R. Mulaveesala, and J. A. Siddique, “Effect of spectral shaping on defect detection in frequency modulated thermal wave imaging,” J. Opt., vol. 17, no. 2, p. 025604, 2015.

3. J. S. Chahal and C. C. Reddy, “Modeling and Simulation of pulsed electroacoustic measurement method,” IEEE Syst. J., vol. 8, no. 4, pp. 1283–1292, 2014.

4. V. Arora, A. J. Siddiqui, R. Mulaveesala, and A. Muniyappa, “Pulse compression approach to nonstationary infrared thermal wave imaging for nondestructive testing of carbon fiber reinforced polymers,” IEEE Sens. J., vol. 15, no. 2, pp. 663–664, 2015.

5. V. Arora, J. A. Siddiqui, R. Mulaveesala, and A. Muniyappa, “Hilbert transform-based pulse compression approach to infrared thermal wave imaging for sub-surface defect detection in steel material,” Insight - Non-Destructive Test. Cond. Monit., vol. 56, no. 10, pp. 550–552, 2014.

6. V. Arora and R. Mulaveesala, “Pulse compression with Gaussian weighted chirp modulated excitation for infrared thermal wave imaging,” Prog. Electromagn. Res. Lett., vol. 44, pp. 133–137, 2014.

Conferences Proceedings

1.V. Arora, R. Mulaveesala, and V. S. Ghali, “Non-destructive testing of steel sample by non- stationary thermal wave imaging” in proc. IEEE international conferences on Signal Processing And Communication Engineering Systems (SPACES)-2015, PP. 527-530, January 2-3, 2015.

2. V. Arora, and R. Mulaveesala, “A numerical approach for non-stationary thermal wave imaging for non-destructive testing and evaluation” in proc. NDE 2014, ISNT, India.

3. J. S. Chahal, and C.C. Reddy,“Long term Space charge measurements in LDPE” in proc. International Conference on High Voltage Engineering & Technology, Hyderabad January 29 - 30, 2015.

4.J .S.Chahal,C.C.Reddy, A.P.S.Tiwana,and A.Gupta,"Modelling the effect of amplifier response in pulsed electroacoustic system" in proc. Electrical Insulating Materials (ISEIM), Proceedings of 2014 International Symposium on , vol., no., pp.362,365, June 1-5, 2014.

5. G. Dua, N. Kumar, and R. Mulaveesala, “Applications of digitized frequency modulated thermal wave imaging for bone diagnostics” in proc. IEEE international conferences on Signal Processing And Communication Engineering Systems (SPACES)-2015, PP. 527-530, Jan. 2-3, 2015.

6. G. Dua, V. S. Ghali, and R. Mulaveesala, “Testing and evaluation of glass fiber reinforced polymers by thermal wave imaging” in proc. IEEE international conferences on Signal Processing And Communication Engineering Systems (SPACES)-2015, PP. 527-530, Jan. 2-3, 2015.

7. G. Dua, and R. Mulaveesala, “Recent advances in non-stationary thermal wave imaging for non- destructive testing and evaluation” in proc. NDE 2014, ISNT, India (2014).

8. H. Garg, A. Rana, Ankit, J. S. Chahal, C. C. Reddy, and R. Sharma, "Investigations on electric field and switching voltage in planar metal foil switches" in proc. IEEE, 9th International Conference on Industrial and Information Systems (ICIIS 2014) pp.1,3, Dec. 15-17, 2014.

9. R. Mulaveesala, V. Arora, A. J. Siddiqui, and M. Amarnath, “Numerical approach to binary complementary Golay coded infrared thermal wave imaging” in Proc. SPIE, 9105- 91050T,(2014).

10. R. Mulaveesala, A. J. Siddiqui, V. Arora, and M. Amarnath, “Non stationary thermal wave imaging fornondestructivetestingandevaluation”in Proc.SPIE,9105,91050R,(2014).

11. R. Mulaveesala, V.S. Ghali, V. Arora, A. J. Siddiqui, and M. Amarnath, “Pulse compression approach to digitized frequency modulated infrared imaging for nondestructive testing of carbon fibre reinforced polymers” in Proc. SPIE, 9105, 91050M,(2014).

12. R. Sharma et al., “Design Space Exploration of Through Silicon Vias for High-Speed, Ultra-Low Loss Vertical Links”, IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium 2014, pp. 1-4, Bangalore, December 2014.

13. R.Sharmaet.al.,“Analytical Model for Inverter Designusing Floating Gate Graphene Field Effect Transistors”, Proceedings of the IEEE Computer Society Annual Symposium on VLSI, pp. 148- 153, Tampa, USA, July 2014 .

14. C. C. Reddy, J. S. Chahal, A. Gupta, and A. P. S. Tiwana, "Role of external and internal parameters on the space charge formation in dielectrics" in proc. Electrical Insulating Materials (ISEIM), Proceedings of 2014 International Symposium on , vol., no., pp.101,103, June 1-5, 2014.

15. C. C.Reddy,andA.P.STiwana,“Investigationsonelectricfieldenhancementincableinsulation under certain recommended test conditions for hvdc power cables” in Proc. of CIGRE-AORC 2014, Tokyo, JAPAN, May 2014.

16. A. J. Siddiqui, G. Dua, V. Arora, V. S. Ghali, M. Amarnath, and R. Mulaveesala, “An industrial vision system for sub surface visualization of structural steel sample using digitized frequency modulated thermal wave imaging: a numerical study”in proc. NDE 2014, ISNT, India (2014).

17. A. P. S. Tiwana, and C. C. Reddy, “Experiments on Breakdown mechanism in current carrying pvc cables under dc voltage conditions” in Proc.ofCIGRE-AORC2014, Tokyo, Japan, 2014.