Dr. Ravibabu Mulaveesala

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Name: 
Dr. Ravibabu Mulaveesala
Designation: 
Associate Professor
Department: 
Department of Electrical Engineering
Biography: 
Dr. Ravibabu Mulaveesala received M.Tech from National Institute of Technology (NIT), Tiruchirapalli in 2000 and PhD from Centre for Applied Research in Electronics, Indian Institute of Technology Delhi (IITD), India in 2007. His research interests include thermal, acoustical and optical methods for non-invasive/non-destructive imaging technologies. He serves as editorial or advisory boards of the several refereed journals of Institute of Physics, Institute of Electrical and Electronics Engineers (IEEE), Institution of Engineering and Technology (IET), Elsevier etc and also to several peer reviewed conferences.
Areas of Research: 
InfraRed Vision and Industrial Imaging.
Signal, Image and Video Processing Techniques for Non-invasive Imaging/Non-destructive Testing Methods.
Non-destructive Testing & Evaluation.
Structural Health Monitoring.
Bio-medical Imaging.
Thermal Non-destructive Testing/Thermal wave imaging.
InfraRed Imaging
Education: 
PhD (Indian Institute of Technology Delhi)
M.Tech (National Institute of Technology Tiruchirappalli)
Work Experience: 
Assistant Professor @ IIITDM Jabalpur (July 2007-July 2010).
Associate Professor @ IIITDM Jabalpur (July 2010-Jan 2012).
Selected Publications/Patents: 

SELECTED PUBLICATIONS IN PEER REVIEWED INTERNATIONAL JOURNALS:

  • (1) Mulaveesala, R., and Tuli, S., Theory of frequency modulated thermal wave imaging for nondestructive subsurface defect detection (2006) Applied Physics Letters, 89 (19), art. no. 191913. 
  • (2) Mulaveesala, R., Vaddi, J.S., and Singh, P., Pulse compression approach to infrared nondestructive characterization (2008) Review of Scientific Instruments, 79 (9), art. no. 094901. 
  • (3) Mulaveesala, R., and Ghali, V.S., Coded excitation for infrared non-destructive testing of carbon fiber reinforced plastics (2011) Review of Scientific Instruments, 82 (5), art. no. 054902. 
  • (4) Ghali, V.S., Mulaveesala, R., and Takei, M., Frequency-modulated thermal wave imaging for non-destructive testing of carbon fiber-reinforced plastic materials (2011) Measurement Science and Technology, 22 (10), art. no. 104018. 
    • (5) Dua, G., Mulaveesala, R., and Siddique, J.A., Effect of spectral shaping on defect detection in frequency modulated thermal wave imaging (2015) Journal of Optics 17 (2), 025604. 
  • (6)Kaur, K., Mulaveesala, R., Rani, A., and Kher, V., Independent component analysis for pulse compressed frequency modulated thermal wave imaging for inspection of mild steel (2020) IOP SciNotes  1(3), 34401.
  • (7) Kher, V., Mulaveesala, R., Rani, A., and Arora, V., Investigations on probability of defect detection using differential filtering for pulse compression favourable frequency modulated thermal wave imaging for inspection of glass fibre reinforced polymers (2020) IOP SciNotes  1(2), 024407.
  • (8) Rani, A., Mulaveesala, R., and Kher, V., An analytical approach for frequency modulated thermal wave imaging for testing and evaluation of glass fiber reinforced polymers (2021) IOP SciNotes  (accepted).
  • (9) Mulaveesala, R., and Dua, G., Non- invasive and non-ionizing depth resolved infra-red imaging for detection and evaluation of breast cancer: a numerical study (2016) Biomedical Physics & Engineering Express 2(5), 055004.
  • (10) Dua, G., and  Mulaveesala, R., Infrared thermography for detection and evaluation of bone density variations by non-stationary thermal wave imaging (2017) Biomedical Physics & Engineering Express 3(1), 017006.
  • (11) Ghali, V.S., Jonnalagadda, N., and Mulaveesala, R., Three-dimensional pulse compression for infrared nondestructive testing (2009) IEEE Sensors Journal, 9 (7), pp. 832-833. 
  • (12) Arora, V., Siddiqui, J.A., Mulaveesala, R., and Muniyappa, A., Pulse compression approach to nonstationary infrared thermal wave imaging for nondestructive testing of carbon fiber reinforced polymers (2015) IEEE Sensors Journal, 15 (2), pp. 663-664. 
  • (13) Ahmad, J., Akula, A., Mulaveesala, R., and Sardana, H.K., Barker coded thermal wave imaging for nondestructive testing and evaluation of steel material  (2019) IEEE Sensors Journal, 19(2), pp. 735-742.
  • (14) Sharma, A., Mulaveesala, R., and Arora, V., Novel analytical approach for estimation of thermal diffusivity and effusivity for detection of osteoporosis  (2020) IEEE Sensors Journal20(11), pp. ‏ 6046-6054.
  • (15) Ahmad, J., Akula, A., Mulaveesala, R., and Sardana, H.K., Probability of detecting the deep defects in steel sample using frequency modulated independent component thermography (2020) IEEE Sensors Journal(accepted).
  • (16) Mulaveesala, R., Arora, V., and Dua, G., Pulse compression favorable thermal wave imaging techniques for non-destructive testing and evaluation of materials (2020) IEEE Sensors Journal, (In Press) (Invited Paper).
  • (17) Sharma, A., Mulaveesala, R., Dua, G., Arora, V., and Kumar, N., Digitized frequency modulated thermal wave imaging for detection and estimation of osteoporosis (2020) IEEE Sensors Journal, (accepted).
  • (18) Dua, G., Arora, V., and Mulaveesala, R., Defect detection capabilities of pulse compression based infrared non-destructive testing and evaluation (2020) IEEE Sensors Journal, (accepted).          
  • (20) Mulaveesala, R., Ghali, V.S., and Arora, V., Applications of non-stationary thermal wave imaging methods for characterisation of fibre-reinforced plastic materials (2013) Electronics Letters, 49 (2), pp. 118-119. 
        • (21)  Dua, G., and Mulaveesala, R., Applications of Barker coded infrared imaging method for characterisation of glass fibre reinforced plastic materials (2013) Electronics Letters, 49 (17), pp. 1071-1073. 
  • (22) Kaur, K. and Mulaveesala, R., Experimental investigation on noise rejection capabilities of pulse compression favourable frequency-modulated thermal wave imaging (2019) Electronics Letters, 55 (6), pp. 352-354. 
    • (23) Kher, V. and Mulaveesala, R., Probability of defect detection in pulse compression favourable frequency modulated thermal wave imaging (2019) Electronics Letters, 55(14), pp. 789-791.
    • (24)Siddiqui, J. A., Patil, S., Chouhan, S. S., Wuriti, S., Arora., V. and Mulaveesala, R., An efficient pulse compression favourable thermal excitation scheme for non-destructive testing using infrared thermography (2020) Electronics Letters, 56(19), pp. 1003-1005.
  • (25) Rani, A. and Mulaveesala, R., Investigations on pulse compression favourable thermal imaging approaches for characterization of glass fibre reinforce polymers (2020) Electronics Letters, 56(19), pp. 995-998.
  • (26) Kher, V. and Mulaveesala, R., Probability of defect detection in pulse compression favourable thermal excitation schemes for infra-red non-destructive testing (2020) Electronics Letters, 56(19), pp. 998-1000. 
    • (27) Kaur, K. and Mulaveesala, R., An efficient selection of independent components for inspection of mild steel sample using infrared thermography (2020) Electronics Letters, 56(19), pp. 990-993.
  • (28) Sharma, A.,  Mulaveesala, R., Dua, G., and Kumar, N., Linear frequency modulated thermal wave imaging for estimation of osteoporosis: An analytical approach (2020) Electronics Letters, 56(19), pp. 1007-1010.
  • (29) Ahmad, J., Akula, A., Mulaveesala, R., and Sardana, H.K., Probability of detection of deep defects in steel samples using Barker coded independent component thermography (2020) Electronics Letters, 56(19), pp. 1005-1007.
(31) Mulaveesala, R., Prem pal and Tuli S., Interface study of bonded wafers by  digitized linear frequency modulated thermal wave imaging (2006) Sensors and Actuators A 128, pp. 209-216. 
  • (32) Arora, V., and Mulaveesala, R., Application of Golay complementary coded excitation schemes for non-destructive testing of sandwich structures (2017) Optics and Lasers in Engineering, 93, pp. 36-39. 
  • (33) Ahmad, J., Akula, A., Mulaveesala, R., and Sardana, H.K.,  An Independent component analysis based approach for frequency modulated thermal wave imaging for subsurface defect detection in steel sample (2019) Infrared Physics and Technology,98, pp.45-54.
  • (34) Dua, G., Mulaveesala, R.,  Kher, V., and Rani, A.,  Gaussian windowed frequency modulated thermal wave imaging for non-destructive testing and evaluation of carbon fibre reinforced polymers (2019) Infrared Physics and Technology,98, pp. 125-131.
    • (35) Kaur, K., and Mulaveesala, R., An efficient data processing approach for frequency modulated thermal wave imaging for inspection of steel material (2019) Infrared Physics and Technology, 103, 103083.
  • (36) Ahmad, J., Akula, A., Mulaveesala, R., and Sardana, H.K.,  Defect detection capabilities of independent component analysis for Barker coded thermal wave imaging (2020) Infrared Physics and Technology,104, 103118.
  • (37) Rani, A., and Mulaveesala, R., Depth resolved pulse compression favourable frequency modulated thermal wave imaging for quantitative characterization of glass fibre reinforced polymer (2020) Infrared Physics and Technology110,103441.
  • (38) Kher, V., and Mulaveesala, R., Probability of defect detection in glass fibre reinforced polymers using pulse compression favourable frequency modulated thermal wave imaging (2021) Infrared Physics and Technology113,103616.
  • (39) Dua, G., Mulaveesala, R., Mishra, P., Kaur, J. InfraRed image correlation for non-destructive testing and evaluation of delaminations in glass fibre reinforced polymer materials (2021) Infrared Physics and Technology, 116, 103803.
    • Spinger: 
    • (40) Ghali, V.S., and Mulaveesala, R., Comparative data processing approaches for thermal wave imaging techniques for non-destructive testing (2011) Sensing and Imaging, 12 (1-2), pp. 15-33. 
  • (41) Juned, A. Siddiqui., Arora, V., Muniyappa, A., and Mulaveesala, R., Infrared thermal wave imaging for nondestructive testing of fibre reinforced polymers (2015) Experimental Mechanics, vol. 55, No 7, pp. 1239-1245. 
  • (42) Arora, V., Mulaveesala, R., and Bison, P., Effect of spectral reshaping on frequency modulated thermal wave imaging for non-destructive testing and evaluation of steel material (2016) Journal of Nondestructive Evaluation 35 (1), pp. 1-7. 
  • (43) Rani, A. and Mulaveesala, R., Frequency Modulated Thermal Wave Imaging for InfraRed Non-destructive Testing of Mild Steel (2021) Mapan (accepted).
  • (45) Mulaveesala, R., and Arora, V., Complementary coded thermal wave imaging scheme for thermal non-destructive testing and evaluation, Quantitative InfraRed Thermography Journal(2017) 14(1), pp. 44-53. 
  • (46) Arora, V., Mulaveesala, R., Rani, A., and Sharma, A., Digitized frequency modulated thermal wave imaging for non-destructive testing and evaluation of glass fibre reinforced polymers, (2019), Journal of Nondestructive Testing and Evaluation,34(1),  pp. 23-32.
  • (48) Sharma, A., Dua, G., and Mulaveesala, R., Breast cancer detection using frequency modulated thermal wave imaging, (2019), The Imaging Science Journal , 67(7), pp. 396-406.
  • (58) Arora, V., Juned, A. Siddiqui., Mulaveesala, R., and Amarnath M., Hilbert Transform based pulse compression approach to infrared thermal wave imaging for sub-surface defect detection in steel material (2014) Insight: Non-Destructive Testing & Condition Monitoring, vol. 56, No 10, pp. 550-552. 
  • (59) Juned, A. Siddiqui., Arora, V., Mulaveesala, R., and Amarnath, M., Modelling of the frequency modulated thermal wave imaging process through finite element method for non-destructive testing of mild steel sample (2015) Insight: Non-Destructive Testing & Condition Monitoring, vol. 57, No 5., pp. 266-268. 
  • (63) Arora, V., Mulaveesala, R., Dua, G., and Sharma, A., Thermal non-destructive testing and evaluation for sub-surface slag detection: Numerical modelling (2020) Insight: Non-Destructive Testing & Condition Monitoring, vol. 62, No 5., pp. 264-268.
  • SELECTED PUBLICATIONS IN PEER REVIEWED INTERNATIONAL CONFERENCES:
  • (64) Mulaveesala, R.,  Arora, V., Dua, G., Rani, A., Kher, V., Sharma, A., Kaur, K.,   Pulse compression favorable thermal wave imaging methods for testing and evaluation of carbon fibre reinforced polymer (2020) Proceedings of SPIE - The International Society for Optical Engineering, 11409-30.
  • (65) Mulaveesala, R.,  Dua, G., Arora, V., Siddiqui, J., Muniyappa, A. Pulse compression favourable aperiodic infrared imaging approach for non-destructive testing and evaluation of bio-materials (2017) Proceedings of SPIE - The International Society for Optical Engineering, 10214,102140G.
  • (66) Mulaveesala, R., Dua, G., Siddiqui, J.A., Subbarao, G.V., Muniyappa, A. A numerical approach for testing and evaluation of mild steel material by thermal wave imaging (2015) Proceedings of SPIE - The International Society for Optical Engineering, 9485, art. no. 948510.
  • (67) Mulaveesala, R.,  Arora, V., Siddiqui, J., Subbarao, G.V., Muniyappa, A. Signal and image processing techniques for testing and evaluation of glass fibre reinforced polymers (2015) Proceedings of SPIE - The International Society for Optical Engineering, 9485, art. no. 94850W.
  • (68) Mulaveesala, R., Siddiqui, J., Arora, V., Dua, G., Subbarao, G.V., Muniyappa, A. Testing and evaluation of concrete structures by thermal wave imaging (2015) Proceedings of SPIE - The International Society for Optical Engineering, 9485, art. no. 94850G.
  • (69) Mulaveesala, R., Muniyappa, A., Siddiqui, J.A., Arora, V. Numerical approach to binary complementary Golay coded infrared thermal wave imaging (2014) Proceedings of SPIE - The International Society for Optical Engineering, 9105, art. no. 91050T.
  • (70) Mulaveesala, R.,  Arora, V., Siddiqui, J.A., Muniyappa, A. Non-stationary thermal wave imaging for nondestructive testing and evaluation (2014) Proceedings of SPIE - The International Society for Optical Engineering, 9105, art. no. 91050R.
  • (71) Mulaveesala, R., Siddiqui, J.A., Arora, V., Muniyappa, A. Pulse compression approach to digitized frequency modulated infrared imaging for non-destructive testing of carbon fibre reinforced polymers (2014) Proceedings of SPIE - The International Society for Optical Engineering, 9105, art. no. 91050M.
  • (72) Mulaveesala, R., Ghali, S.V., Arora, V., Siddiqui, J.A., Muniyappa, A., Takei, M. Theory, modeling and simulations for thermal wave detection and ranging (2013) Proceedings of SPIE - The International Society for Optical Engineering, 8705, art. no. 87050Z.
  • (73) Mulaveesala, R., Ghali, V.S., Arora, V., Siddiqui, J.A., Muniyappa, A., Takei, M. Recent advances in thermal wave detection and ranging for nondestructive testing and evaluation of materials (2013) Proceedings of SPIE - The International Society for Optical Engineering, 8705, art. no. 870510.
  • (74) Mulaveesala, R., Siddiqui, J.A., Arora, V., Ghali, V.S., Muniyappa, A., Takei, M. Nondestructive testing and evaluation of composites by non-invasive IR imaging techniques (2013) Proceedings of SPIE - The International Society for Optical Engineering, 8705, art. no. 87050Y.
  • (75) Mulaveesala, R., Subbarao, G.V., Amarnath, M. Matched excitation for thermal nondestructive testing of carbon fiber reinforced plastic materials (2012) Proceedings of SPIE - The International Society for Optical Engineering, 8354, art. no. 835408.
  • (76) Mulaveesala, R., Panda, S.S.B., Mude, R.N., Amarnath, M. Nondestructive evaluation of concrete structures by nonstationary thermal wave imaging (2012) Proceedings of SPIE - The International Society for Optical Engineering, 8354, art. no. 83540B.
  • (77) Mulaveesala, R., P Nagarjuna, V., Ravi, D., Amarnath, M. Thermal wave imaging techniques for inspection of plywood materials (2012) Proceedings of SPIE - The International Society for Optical Engineering, 8354, art. no. 83540C.
    • (78) Mulaveesala, R., Ghali, S.V., Balyan, L.K., Lamba, S.S. Signal and image processing techniques for digitized frequency modulated thermal wave imaging for characterization of fiber reinforced plastics (2011) Proceedings of SPIE - The International Society for Optical Engineering, 8013, art. no. 80130R.
  • (79) Awasthi, S.,  Mulaveesala, R., Tuli, S. Thermal non-destructive evaluation of scaling in boiler tubes (2007) Proceedings of SPIE - The International Society for Optical Engineering, 6541, art. no. 654114.
  • (80) Mulaveesala, R., Tuli, S. Phase sensitive digitized frequency modulated thermal wave imaging and pulse compression for NDE applications (2006) Proceedings of SPIE - The International Society for Optical Engineering, 6205, art. no. 620515.
  •  American Institute of Physics (AIP):
  • (81) Mulaveesala, R., Tuli, S. Applications of frequency modulated thermal wave imaging for non-destructive characterization (2008) AIP Conference Proceedings, 1004, pp. 15-22.
  • (82) Arora, V., Mulaveesala, R., Subbarao, G.V. Non-destructive testing of steel sample by non-stationary thermal wave imaging (2015) International Conference on Signal Processing and Communication Engineering Systems - Proceedings of SPACES 2015, in Association with IEEE, art. no. 7058212, pp. 527-530.
  • (83) Dua, G., Kumar, N., Mulaveesala, R. Applications of digitized frequency modulated thermal wave imaging for bone diagnostics (2015) International Conference on Signal Processing and Communication Engineering Systems - Proceedings of SPACES 2015, in Association with IEEE, art. no. 7058209, pp. 518-521.
  • (84) Dua, G., Subbarao, G.V., Mulaveesala, R. Testing and evaluation of glass fiber reinforced polymers by thermal wave imaging (2015) International Conference on Signal Processing and Communication Engineering Systems - Proceedings of SPACES 2015, in Association with IEEE, art. no. 7058211, pp. 522-526.
  •  World Congress in Industrial Process Tomography:
  • (85)Mulaveesala, R., Takei, M. Frequency modulated thermal wave imaging for non destructive testing (2010) 6th World Congress in Industrial Process Tomography pp. 1406-1411.
  •  Association for Computing Machinery:
  • (86) Kaur, K., and Mulaveesala, R., Active Infrared Imaging for Estimation of Sub-Surface Features in a Steel Material (2019) Third International Conference on Computing and Network Communications (CoCoNet'19) , Trivandrum, Kerala, India on December 18-21, 1570592066.
  • (87) Rani, A., and Mulaveesala, R., Detection of slags in structural steel sample using InfraRed thermal wave imaging (2021) Second International Conference on Aspects of Materials Science and Engineering (ICAMSE 2021), Panjab University, Chandigarh, 160014, India on March 05-06, MaterialsToday:Proceedings,https://doi.org/10.1016/j.matpr.2021.01.022.
  • (88) A system and method for non-destructive characterization in solids and compositesPatent Number: 294805 (Granted).
  • (89) Thermal imaging for identifying a defect in a material, Application Number. 201911012086, LRN no: P3591-IN, 27/03/2019.
  • (90) US Patent Application Number.: 16/830,131, Date of Filing: 25 March 2020.
  • BOOK:
  • (92). C K Mukhopadhyay and R Mulaveesala, Advances in Non-Destructive Evaluation, Springer Singapore, 2021.DOI: 10.1007/978-981-16-0186-6.
  • Book Chapter:
  • (95). R Mulaveesala, G Dua , V Arora, Computer-aided diagnosis methods for non-invasive imaging of sub-skin lesions, CRC Press, Taylor & Francis Group, 2021.
Other Information: 

External Sponsored Research Grants* (From Last Five Years):

S.No Title Sponsoring Agency Period Approximate Amount (INR)
1 Matched filter approach for chirp excited infrared imaging for non-destructive characterization. Science & Engineering Research Board (SERB) 2014-2017 46,000,00.00/-
2 Non-destructive testing of Carbon Fibre Reinforced Polymers (CFRP) using non-stationary thermal Imaging technique. Ministry of Defense (AR&DB) 2014-2017 22,000,00.00/-
3 Depth resolution and sizing studies in Thermal Wave Detection And Ranging (TWDAR). Science & Engineering Research Board (SERB) 2014-2016 30,000,00.00/-
4 The development of a portable THERMOgraphy-based health deTECTion system (THERMOTECT) In breast cancer screening. Global Innovation & Technology Alliance  2017-2019 760,000,00.00/-

 *As as PI/Co-PI/Partner

Professional Distinctions (selected): 

  • Institute Level Best Project (Postgraduate Level) Award for Open House-I2 Tech 2006 (IIT Delhi Alumni Award).
  • Expert member for Senior Scientific/Technical Officers Selection Committee of Department of Atomic Energy (DAE), Govt. of India.
  • Expert Advisory Group Member for Evaluation of Project Proposals, Department of Science & Technology (DST), Govt. of India.
  • Reviewer to SERB Project Proposals, Department of Science & Technology (DST), Govt. of India.
  • Reviewer to Project Proposals of KSCSTE: Kerala State Council for Science, Technology and Environment  (KSCSTE)
  • Reviewer to National Project Implementation Unit (NPIU), MHRD, Govt. of India.
  • Invited Talk on Non-destructive Evaluation of Composites at GE (John F. Welch Technology Centre) Composites Workshop: March 16th-18th at JFWTC, Bangalore, India, 2015.
  • Invited Talk at Defence Metallurgical Research Laboratory (DMRL) on Advanced Infrared Thermography,  Ministry of Defence, Govt. of India, 2015.
  • Invited Presentation on Non-destructive Testing of Composites by Naval Science & Technological Laboratory, Ministry of Defence, Govt. of India.
  • Keynote/Invited Speaker: The first QIRT-ASIA conference on quantitative infrared thermography-2015.
  • Invited Talk @ National conference on Non-destructive Evaluation (NDE-2015), ISNT, Hyderabad, India.
  • Plenary Talk @ IEEE International conference on Signal Processing And Communication Engineering Systems (SPACES 2015).
  • Invited Presentation on Acquisition, Understanding and Applications of Multiscale Biomedical Images by Information Technology Research Academy, Dept. of Information Technology, Ministry of Communications and Information Technology, Govt. of India.
  • Invited Presentation on Frequency Modulated Thermal Wave Imaging for Non destructive Testing of Solids, Beihang University, Beijing, China.
  • Invited Presentation on Research on Non Destructive Testing by Thermal Diffusion Waves by Nihon University, Tokyo Japan.
  • Invited to deliver lectures for Level II Training and Certification course on Infrared Thermography by Indian Society for Nondestructive Testing (kalpakkam chapter), Feb-2015.
  • Invited to deliver lectures on Infrared Thermography by Indian Society for Nondestructive Testing (thiruvananthapuram chapter), October-2015.
  • Invited Presentation on Frequency Modulated Thermal Wave Imaging and Its Applications at 14th Asian Pacific Conference on Non-destructive Testing 2013. 
  • Invited to deliver Series of Lectures at National level Workshop on Durability and Performance Assessment of the Emerging Advanced Materials by Non-destructive Evaluation.
  • Invited to deliver Lectures in the Training Course on Digital Signal Processing at the Centre for Continuing Education, IIT Roorkee 2013. 
  • IEEE Advisory Committee Member: International Conference on Control, Instrumentation, Communication & Computational Technologies (ICCICCT 2014).
  • IEEE Advisory Committee Member: International Multi-conference on Automation, Computing, Communication, Control and Compressed Sensing-2013.
  • IEEE Advisory Committee Member: International conference on Signal Processing And Communication Engineering Systems (SPACES 2018).
  • IEEE Advisory Committee Member: International conference on intelligent computing, instrumentation and control technologies (ICICICT-2017)
  • Advisory Committee Member: International Conference on Technical Challenges in Instrumentation, Computer Science, Civil and Mechanical, Electronics and Electrical Engineering (ICCEECON-2015).
  • Advisory Committee Member: International Conference on innovations in Computer, Communication and Control technologies-2014.
  • Advisory Committee Member: International Conference on Control, Instrumentation, Communication & Computational Technologies (ICCICCT)-2015.
  • Technical Programme Committee MemberInternational Conference on Advances in Computing, Communications and Informatics-2015.
  • Invited Talk @ National conference on Non-destructive Evaluation (NDE-2014), ISNT, PUNE, India.
  • Co-ordinator for special issue on Infrared Thermography, Journal of Non destructive Testing & Evaluation, Vol.12(2), 2013.
  • Session Chair: NDE using Thermography - 2 @ Asian Pacific Conference on Non-destructive Testing-2013, Mumbai, India, November 2013.  
  • Referee to Peer Reviewed Journals (selected): 
  • Proceedings of the Royal Society A: Mathematical, Physical & Engineering Sciences
  • AIP: Applied Physics Letters 
  • AIP: Review of Scientific Instruments
  • AIP: Journal of Applied Physics 
  • IOP: Measurement Science & Technology
  • IOP: Journal of Physics D: Applied Physics
  • IEEEJournal of Selected Topics in Signal Processing
  • IEEE: Sensors Journal
  • IEEE: Photonics Journal
  • IEEE/OSA: Journal of Lightwave Technology
  • IEEE: Transactions on Terahertz Science and Technology
  • IEEE: Transactions on Industrial Electronics
  • IEEE: Transactions on Industrial Informatics
  • IEEETransactions on Circuits and Systems I: Regular Papers
  • IEEE: Transactions on Instrumentation and Measurement
  • IEEE: Transactions on Medical Imaging
  • IEEE: Transactions on Education
  • IEEE: Access
  • IET: Electronics Letters
  • IET: Image Processing
  • Elsevier: Infrared Physics & Technology
  • Elsevier: Non-destructive Testing & Evaluation International 
  • Elsevier: Journal of Physics & Chemistry of Solids
  • Elsevier: Materials Letters
  • ElsevierComposites Part B: Engineering
  • ElsevierCorrosion Science
  • Elsevier: International Journal of Heat and Mass Transfer
  • ElsevierInternational Journal of Thermal Sciences
  • ElsevierMechanical Systems and Signal Processing
  • Elsevier: Polymer Testing
  • Elsevier: Chemometrics and Intelligent Laboratory Systems
  • Elsevier: Journal of Tissue Viability
  • Elsevier: Automation in Construction
  • Elsevier: Heliyon
  • Elsevier: Computerized Medical Imaging and Graphics
  • Elsevier: Journal of Advanced Research
  • Elsevier: Measurement 
  • Springer: Journal of Non-destructive Evaluation
  • SpringerOpto-Electronics Review
  • SpringerInternational Journal of Thermophysics
  • SpringerPure and Applied Geophysics
  • Taylor & Francis: Quantitative InfraRed Thermography Journal
  • Taylor & Francis: IETE Journal of Research
  • ASNT: Materials Evaluation
  • ASTMJournal of Testing and Evaluation
  • BINDT: Insight: Non-Destructive Testing and Condition Monitoring
  • SPIE: Journal of Electronic Imaging
  • SPIEOptical Engineering
  • ACI: Structural Journal
  • ACI: Materials Journal
  • PIER: Progress in Electromagnetic Research & Journal of Electromagnetic Waves and Applications
  • ETRI Journal
  • DRDO: Defence Science Journal
  • Citations: 
  • Ms. Kirandeep Kaur
  •  
  • M.Tech Thesis Supervision (Completed): 5
  • Mr. M. Manupuran
  • Ms. Pooja Dubey
  • Ms. Ankita Dey
  •  
  • B.Tech Projects Supervision (Completed): 15 (45 Students) 
  • First B.Tech (undergraduate) Project: (Citation in US Patent
  •  
  • PhD Thesis Evaluations (in the field of Non-invasive Imaging/Non-destructive Testing): 10
  • Integrated M.Tech PhD Thesis Evaluations (in the field of Non-invasive Imaging/Non-destructive Testing): 2
  • MS (By Research) Thesis Evaluation (in the field of Non-invasive Imaging/Non-destructive Testing): 2
  • Click Here for Research Highlights @ IRIL-EED-IIT Ropar

IRIL_EED@IITRPR specializes in the development of coded excited thermal wave/infrared imaging modalities for commercial, defense and medical applications. It enables users to carry out thermal imaging for biological and industrial inspection applications to achieve high test resolution and sensitivity with the usage of low peak power heat sources in a moderate experimentation time. Our motto is to bring the cost-effective thermal imaging modalities for everyday use.